梅原康敏,諸貫信行,ナノフォーカスX線透過像を用いたThrough-Silicon Viaの三次元形状簡易推定法-推定原理と誤差評価-,精密工学会志,Vol. 82, No. 10 (2016-10) pp. 901-906, doi.org/10.2493/jjspe.82.901
Kenta Wakamatsu, Nobuyuki Moronuki, Fabrication of Stacked Layers of Fine Particle Assembly Aiming at Wavelength-Selective Reflection, Int. J. of Automation Technology, Vol.10, No.6 (2016-11) pp.964-970.
Nobuyuki Moronuki, Nguyen Phan, and Norito Keyaki, Fabrication of High Aspect Ratio Silicon Nanostructure with Sphere Lithography and Metal-Assisted Chemical Etching and its Wettability, Int. J. of Automation Technology, Vol.10, No.6 (2016-11) pp.971-976.
Yasutoshi Umehara and Nobuyuki Moronuki, Nondestructive inspection and inline estimation of profiles of copper-filled through-silicon vias with voids by a nano-focus X-ray microscope, Proc. IITC2016, (2016-5-26), pp.77-79.
Nobuyuki Moronuki, Nguyen Phan, Fabrication of micro-/nano-pore arrays with metal-assisted chemical etching and surface modification aiming at liquid retaining function, Proc. euspen (2016-6-1), Nottingham, UK.
Nobuyuki Moronuki, Nguyen Phan, Effect of Structural Design and Infused Lubricant of Self-cleaning Surfaces on Durability against Mechanical Contact, 16th ICPE, JSPE(2016-11), 4pages
Yasutoshi Umehara, A simple 3D profile estimation of through-silicon vias (TSVs) based on an X-ray projection image and its robustness evaluation, 16th ICPE, JSPE(2016-11), 5pages