T. Shimizu, T. Kakegawa, M. Yang, Micro-texturing of DLC thin film coatings and its tribological performance under dry sliding friction for microforming operation: Journal of Procedia Engineering, Vol.81(2014), pp. 1884–1889 . (DOI:10.1016/j.proeng.2014.10.251)
Y. Jin, S. Yasuhara, T. Shimizu, M. Yang, Tribological characterization of boron nitride films against pure-titanium for microforming die application, Journal of Procedia Engineering, Vol.81(2014), pp. 1909–1914. (DOI:10.1016/j.proeng.2014.10.255)
Q. Zheng, T. Aoyama, T. Shimizu, Ming Yang, Experimental and Numerical Analysis of Springback Behavior Under Elevated Temperatures in Micro Bending Assisted by Resistance Heating, Journal of Procedia Engineering: Vol.81(2014),1481-1486. (DOI:10.1016/j.proeng.2014.10.177)
Q. Zheng, T. Shimizu, T. Shiratori, Ming Yang, Tensile properties and constitutive model of ultrathin pure titanium foils at elevated temperatures in microforming assisted by resistance heating method, Materials and Design: Vol.63(2014),389-397. (DOI:10.1016/j.matdes.2014.06.039) , Impact factor: 3.50
T. Aoyama, T. Shimizu, Q. Zheng, M. Yang, Effect of Heating on Springback in Heat Assisted Microbending: Advanced Materials Research, Vol.939 (2014), pp.409-414.(DOI:10.4028/www.scientific.net/AMR.939.409)
T Ikushima, T. Shimizu, M. Yang, Tensile Property of Electrochemically Polished Titanium Alloy, Advanced Materials Research: Vol.939 (2014), pp.146-151(DOI:10.4028/www.scientific.net/AMR.939.146)
T. Shimizu, T. Watanabe, Y. Teranishi, H. Nagasaka, H. Komiya, K. Morikawa, M. Yang, Influence of HIPIMS pulse duration on the properties of TiAIN films deposited at low substrate temperature, E-MRS 2014 Spring Meeting, May 2014
T. Miyamoto, H. Nagasaka, T. Shimizu, Y. Teranishi, T. Watanabe, M. Yang, High-rate synthesis of boron doped diamond by hot filament CVD method and its electrochemical properties, E-MRS 2014 Spring Meeting, May, 2014
Y. Banba, T. Shimizu, M. Yang, Development of a dry process for coating metal nanoparticles on carbon nanotubes, JSME/ASME 2014 International Conference on Materials and Processing (ICMP2014), June 2014
Q. Zheng, T. Shimizu, M. Yang, Finite element analysis of springback behavior in resistance heating assisted micro bending process, JSME/ASME 2014 International Conference on Materials and Processing (ICMP2014), June 2014
R. Yamaguchi, Y. Bai, T. Shimizu, M. Yang, Effect of ultrasonic vibration on stress relaxation in micro-compression test with step motion, JSME/ASME 2014 International Conference on Materials and Processing (ICMP2014), June 2014
Y. Suzuki, T. Shimizu, M. Yang, Multiscale modeliing and simulation of biomolecule diffusion on the reaction field in micro bioanalysis device, The 16th International Symposium on Flow Visualizaion (ISFV16), June 2014
T. Shimizu, H. Komiya, T. Watanabe, Y. Teranishi, H. Nagasaka, K. Morikawa, M. Yang, Effects of HIPIMS Deposition Pressure on (Ti, Al)N Film Properties at Inner Wall of Sub-Millimeter Scale Small Holes, 5th Ineternational Conference on HIPIMS July 2014
Q. Zheng, T. Aoyama, T. Shimizu, M. Yang, Experimental and numerical analysis of springback behavior under elevated temperatures in micro bending assisted by resistance heating, The 11the International Conference on Technology of Plasticity (ICTP 2014), October2014
T. Shimizu, T. Kakegawa, M. Yang, Micro-texturing of DLC thin film coatings and its tribological performance under dry sliding friction for microforming operation, The 11the International Conference on Technology of Plasticity (ICTP 2014), October 2014
Y. Jin, S. Yasuhara, T. Shimizu, M. Yang, Tribological characterization of boron nitride films against pure-titanium for microforming die application, The 11the International Conference on Technology of Plasticity (ICTP 2014), October 2014
Q. Zheng, T. Shimizu, M. Yang, Effect of Heat on Tensile Properties of Thin Pure Titanium Foils, The 7th Asian Workshop on Micro/Nano Forming Technology, November 2014
K. Koshimizu, Q. Zheng, T. Shimizu, M. Yang, Development of microforming process combined with thin film transfer printing, The 7th Asian Workshop on Micro/Nano Forming Technology, November 2014
T. Shimizu, S. Kosuge, M. Yang, Grain size effect on transferability in micro-coining process assisted by ultrasonic vibration, The 7th Asian Workshop on Micro/Nano Forming Technology, November 2014
Y. Jin, S. Yasuhara, T. Shimizu, M. Yang, The influences on filament temperature on the structure of boron nitride films for microforming die application, The 7th Asian Workshop on Micro/Nano Forming Technology, November 2014
T. Shimizu,Y. Teranishi, K. Morikawa, H. Komiya, H. Nagasaka, M. Yang, Effect of HIPIMS pulse frequency on low temperature deposition of TiAlN films, International Symposium on Advanced Plasma Science and its Application for Nitrides and Nanomaterials, IS-Plasma2015, March 2015
International Conference for Leading & Young Material Scientists, Asia-pacific Society of Materials Research, Low temperature deposition of TiAlN thin films by high‐power impulse magnetron sputtering, December 23rd 2014